1. Step: Cleaning weathered paintwork and removing deep scratches KOCH Heavy Cut Abrasive paste H9.02 250ml.
2. Step: Removal of holograms and final protection Micro Cut & Finish P3.01 micro-abrasive polishing paste with carnauba wax.
Micro Cut & Finish P3.01 is a state-of-the-art, final polishing, anti-hologram compound with a high-gloss finish. It is designed for machine polishing to remove polishing marks, holograms, fine scratches, and sanding marks up to P3000 grit. It is suitable for all types of paint, including scratch-resistant finishes.
Thanks to the use of highly specialized and extremely uniform abrasive particles, it delivers a brilliant and long-lasting high gloss even on dark and similarly sensitive paint colors under extreme lighting conditions. Holograms and fine scratches are mechanically removed.
The high-gloss anti-hologram polish Micro Cut M3.02 is very easy to work with and can be removed without leaving residue. It contains carnauba wax and non-volatile silicones.
Cut level: 3.2
Gloss level: 9.5
Instructions for use:
Wash and dry the surface to be polished. Shake the polishing compound well before use and test its suitability and compatibility.
To achieve optimal polishing results, we recommend using a KOCH Micro Cut Pad purple and a dual-action polisher with forced rotation (e.g., Makita PO5000C, highest speed setting). Apply the polish evenly over the entire surface of a dry or new polishing pad.
With the machine switched off, spread a thin layer of polish over the paint, then polish using light pressure in a cross pattern until a transparent film forms. This indicates that the aluminum oxide abrasives in the polish have fully broken down.
Do not use polishing pads used with this product for other products. To remove residue without scratching, we recommend using a professional microfiber cloth.
Storage and safety:
Protect from frost and excessive heat. Do not use on hot surfaces.
Additional information:
EUH 210 – Safety data sheet available on request.
The mixture does not contain substances harmful to the endocrine system (less than 0.1%).